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Enhancing Mechanical Robustness and Integrity of a Large Advanced Package with Embedded Fine-Pitch Interconnect Chips

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909771

Authors: Lin Ji, Tai Chong Chai

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Agency for Science, Technology and Research

Award: G4839195661

OpenAlex ID: W4408325403

FWCI:

Cites: 2

Cited by:

Related to: 10