Work

Investigation of NiSn4 Formation in the Reaction between SnBi Solder and ENEPIG Substrate

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909902

Authors: Yi-Wun Wang, Cheng-Ting Tsai, Tzu-Yi Lin

Institution: Tamkang University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Science and Technology Council, Society for Experimental Mechanics, National Taiwan University

Award: Low-Temperature Solder for Wearable Device Bonding

OpenAlex ID: W4408325406

FWCI:

Cites: 12

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Related to: 10