Work

Investigation of UBM/RDL Contact Resistance Based on ICP Sputter Etch Conditions and Critical Design Dimensions

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909756

Authors: Patrik Carazzetti, Carl Drechsel, Nico Härtl, Jürgen Weichart, Kay Viehweger, Ewald Strolz

Institution: All Silicon System Integration Dresden

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325410

FWCI: 1.778

Cites: 11

Cited by: 1

Related to: 10