Work

Material Sensitivity of a Fan-Out Package Warpage - Simulations and Experimental Validation

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909768

Authors: Sasi Kumar Tippabhotla, David Ho Soon Wee

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325413

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Cites: 8

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Related to: 10