Work

A Study in Improvement of Anisotropic Copper Wet Etching for Semiconductor Packaging

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909773

Authors: Suyeon Park, Inyeol Park, Jihwan Kong, Jonghyun Seo

Institution: Korea Aerospace University

Language: English

Topic: Corrosion Behavior and Inhibition

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325418

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Cites: 7

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Related to: 10