Work

Power Integrity Optimization by DTC for 2.5D CoWoS Package

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909758

Authors: Shengjuan Zhou, Changming Song, Qian Wang, Jian Cai

Institution: Tsinghua University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4408325419

FWCI:

Cites: 7

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Related to: 10