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Printability Evaluation of Water-Soluble Type 7 Solder Paste for Fine Pitch Advanced Package Interconnects

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909844

Authors: Dong–Gyu Choi, Si Hun Park, Sungwook Mhin, Won Sik Hong, Sehoon Yoo

Institutions: Korea Institute of Industrial Technology, Kyonggi University, Korea Electronics Technology Institute

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325496

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Cites: 5

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Related to: 10