Work

Effects of Bi contents in Sn–5Ag lead-free solders on mechanical properties and morphology of IMC

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909877

Authors: Kuan-Cheng Liu, Chuan-Shun Li, Wen-Yu Teng, Liang-Yih Hung, Yu-Po Wang

Institution: Siliconware Precision Industries (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325504

FWCI:

Cites: 6

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Related to: 10