Work

The Influence of Pd Layer Thickness in ENEPIG on Solder Joint Morphology and Reliability

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909873

Authors: Jae Jun Yoon, Seahwan Kim, Minji Lee, HyeRin Jin, Taek Soo Shin, Seung-Boo Jung

Institutions: Sungkyunkwan University, Samsung Electronics (South Korea)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325531

FWCI: 1.612

Cites: 7

Cited by: 2

Related to: 10