Work

Advanced Prediction Model for SACQ Solder Reliability Assessment for Automotive Memory Applications

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909977

Authors: Ling Pan, Fa Xing Che, Yeow Chon Ong, Wei Yu, Hong Wan Ng, Gokul Kumar, Richard Fan, Pony Hsu

Institutions: Micron (Singapore), Micron (United States), Micron (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325532

FWCI: 0.806

Cites: 9

Cited by: 1

Related to: 10