Work

Intermetallic Growth Kinetics of Recycled Gold Bonding Wire

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909819

Authors: Yi Jing Chen, Yung Sheng Zou, Min Hua Chung, CL Gan, Renz Raymund Calamiong, Chris Sim

Institution: Micron (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Responsible consumption and production

Open Access status: closed

OpenAlex ID: W4408325534

FWCI: 0.778

Cites: 18

Cited by: 1

Related to: 10