Work

Economical Characterization of Cu/Dielectric Hybrid Bonded Interfaces Using Ion Milling Method

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909931

Authors: Huan Ching Kenneth Lee, Meng Keong Lim, Vasarla Nagendra Sekhar, Mishra Dileep Kumar, Leijun Tang

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325535

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Cites: 5

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Related to: 10