Work

Silicon Interposer Heterogenous Integration Platform for Millimeter-Wave Ka and V Band Satellite Applications

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909870

Authors: Sun Mei, Javier Ong Jun Wei, Wu Jia Qi, Sharon Lim Pei Siang, Ye Yong Liang, Ratan Bhimrao Umralkar, Lau Boon Long, Lim Teck Guan, Kevin Chai Tshun Chuan

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Economic Development Board - Singapore

Award: G1214706278

OpenAlex ID: W4408325536

FWCI: 0.806

Cites: 5

Cited by: 1

Related to: 10