Work

Wafer Level Fabrication of Embedded Liquid Cooling Solutions on Heating Devices with TSV Interconnects

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909949

Authors: Lau Boon Long, Javier Ong, Jong Ming Chinq, Zhang Xiaowu, Feng Huicheng

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325539

FWCI: 0.779

Cites: 12

Cited by: 1

Related to: 10