Work

Electromigration Study of Cu Pillar Bumps Using Experimental and Numerical Methods

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909890

Authors: Facheng Zhao, Liping Zhu, Alfred Yeo

Institution: STATS ChipPAC (Singapore)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325550

FWCI: 0.806

Cites: 7

Cited by: 1

Related to: 10