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Wafer Thickness Measurement by Using Spectral Interferometry in Advanced Packaging

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909970

Authors: Chia-Hung Cho, Yi-Sha Ku, Cheng-Kang Lee, Chun-Wei Lo

Institution: Industrial Technology Research Institute

Language: English

Topic: Optical measurement and interference techniques

Subfield: Computer Vision and Pattern Recognition

Field: Computer Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325555

FWCI: 0.687

Cites: 5

Cited by: 3

Related to: 10