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Maximizing Productivity Through Bonding Sequence Optimization in the Chip on Wafer Process

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909760

Authors: Junsang Kim, Hyeonjun Yun, Mingu Kang, Jisu Kim, Kwanghyun Cho, Hansung Cho, Ohwoon Kwon, Geewoong Joung, Jungchul Lee, Yunha Kim, Bumki Moon, Minwoo Rhee, Youngseok Jung, Byungjoon Lee

Institutions: Samsung (South Korea), Samsung Electronics (South Korea)

Language: English

Topic: Advanced Manufacturing and Logistics Optimization

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325556

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