Non-Destructive Analysis of Voiding in Thermal Interface Material of High-Performance Computing Devices Using B-Mode Scanning Acoustic Microscopy (B-SAM)
Year: 2024
Type: conference-paper
Authors: Mei-Hui Song, Wai-Kit Tang
Institution: Advanced Micro Devices (Singapore)
Language: English
Subfield: Mechanics of Materials
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: Advanced Micro Devices
OpenAlex ID: W4408325565