Work

Integration Module of Dual MOSFET Switching Circuit Using Embedded Silicon Fan-Out (eSiFO) Technology

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909888

Authors: Wenbin Qiang, Xiangou Zhang, Shuairong Deng, Zhenzhong Yang, Xiangyu Sun

Institution: China Academy of Engineering Physics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325567

FWCI:

Cites: 8

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Related to: 10