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A Chip on Board Packaging Solution for 4×100Gbps PAM4 Optical Engine

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909748

Authors: Xu Feng, Li Zhenyu, Chi Ting-Ta, Wen Lee, Yuan Xiaojun

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: Semiconductor Lasers and Optical Devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325591

FWCI: 0.781

Cites: 7

Cited by: 1

Related to: 10