Work

Optimizing Chiplet Placement in Thermally Aware Heterogeneous 2.5D Systems Using Reinforcement Learning

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909800

Authors: Partha Pratim Kundu, Zhuang Furen, Sezin Kircali Ata, Hou Yubo, Mihai Dragos Rotaru, Rahul Dutta, Ashish James

Institutions: Agency for Science, Technology and Research, Institute for Infocomm Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325606

FWCI: 0.779

Cites: 23

Cited by: 1

Related to: 10