Numerical Optimization of PCM-Based Heat Sink for Thermal Management of High-power-density Electronics
Year: 2024
Type: conference-paper
Authors: Ran Hu, Jianyu Du, Shangyang Shi, Huiquan Cao, Chi Zhang, Wei Wang, Yufeng Jin
Institution: Peking University
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408325613