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Die Attach Material Choice for MEMS Cavity Packages

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909794

Authors: Mark Shaw, Daniele Simoncini, Roseanne Duca, Luca Falorni, Paola Carulli, Patrick Fedeli, Davide Brignoli, Haiyang Cheng, Jane Wanzel Rillera

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325615

FWCI:

Cites: 6

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Related to: 10