Work

Realizing Void-Free Superconducting TSV on Interposer with One-Step Liner-Less Indium

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909898

Authors: Norhanani Jaafar, Hongyu Li, Tseng Ya-Ching, Haitao Yu, Meng Keong Lim

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Research Foundation, Science and Engineering Research Council

Awards: G3726336, G5583233903

OpenAlex ID: W4408325625

FWCI:

Cites: 5

Cited by:

Related to: 10