Work

Signal Integrity Simulation and Analysis for 2.5D Advanced Package Interconnect Based on Universal Chiplet Interconnect Express (UCIe)

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909900

Authors: Yuxuan Fan, Hanchen Gan, Yunyan Zhou, Bo Lei, Gang Song, Qidong Wang

Institutions: Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Key Research and Development Program of China

Award: G5966273939

OpenAlex ID: W4408325639

FWCI: 5.468

Cites: 6

Cited by: 7

Related to: 10