Work

MSL 1 Failure Mechanism and Solution for Silicon Carbide (SiC) Power Package with Pressure-Less Sintering Die Attach process on Bare Copper Lead Frame

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909959

Authors: Alex Ong Heng Giap, Jinxiu Gong, Xiaoxia Hu, Cong Yue, Yakai Feng

Institution: Tianjin University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325648

FWCI:

Cites: 10

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Related to: 10