Finite Element Analysis of the Effect of Structural Parameters and Misalignment on Bonding Strength in Fine-Pitch Hybrid Bonding
Year: 2024
Type: conference-paper
Authors: Jingyu Shi, Lin Tan, Yang Hu, Junpeng Fang, Jian Cai, Zheyao Wang, Qian Wang
Institution: Tsinghua University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408325653