Work

Effects of Solder Reflow Peak Temperature on Sn3.5Ag to Cu-OSP Surface

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909942

Authors: Jingjian Gan, Dazhen Wu, Stella Dong, Xingshou Pang, Ruby Jiang, Jinmei Liu, Mingyue Xia

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325657

FWCI:

Cites: 5

Cited by:

Related to: 10