Work

Reliability Study of Multi-Chip GaN Device by Fan-Out Panel Level Package

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909863

Authors: Bo Luo, Qingyuan Tang, Miaomiao Liu, Chang Huang

Language: English

Topic: GaN-based semiconductor devices and materials

Subfield: Condensed Matter Physics

Field: Physics and Astronomy

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325668

FWCI: 1.208

Cites: 7

Cited by: 1

Related to: 10