Work

Study on Substrate Copper Pad Crack Through Experiment and Simulation

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909963

Authors: Wei Yu, Fa Xing Che, Yeow Chon Ong, Ling Pan, Wee Gee Cheong

Institution: Micron (Singapore)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325681

FWCI: 0.806

Cites: 12

Cited by: 1

Related to: 10