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Low Flux Residue No-Clean Solder Paste for System-in-Package (SiP) Application

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909859

Authors: Xinfang Liu, Jinjin Bai, Fen Chen, Yan Liu

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325688

FWCI: 0.806

Cites: 5

Cited by: 1

Related to: 10