Work

Optimization of Aluminum Wire Bonding on Niobium Pad for Cryogenic Packaging

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909835

Authors: Norhanani Binte Jaafar, Li Hongyu, Chong Ser Choong

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Science Foundation, United Arab Emirates

Award: G2798387050

OpenAlex ID: W4408325692

FWCI: 0.781

Cites: 6

Cited by: 1

Related to: 10