Work

ECC-Based Flux Cleaning Monitoring for Improved Reliability in High-Performance Computing (HPC) and Artificial Intelligence (AI)

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909893

Authors: Yu-Sheng Wang, Baron Huang, Wen-Yi Lin, Zhihua Zou, Chien-Li Kuo

Institution: Taiwan Semiconductor Manufacturing Company (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325701

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Cites: 11

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Related to: 10