Work

High-Thermal-conductivity Dummy Die and Finned Lid for Enhanced Liquid Cooling of 2.5D ICs

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909892

Authors: Hsin-Cheng Lin, Chia-Wei Tseng, Yu-Ying Chen, Ho-Ming Tong, C. W. Liu

Institution: National Taiwan University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

Funder: National Science Council

Award: G2818597072

OpenAlex ID: W4408325709

FWCI:

Cites: 11

Cited by:

Related to: 10