Work

Electromigration Reliability Analysis of Fine Line RDL Damascene Interconnects

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909784

Authors: Hsiao Hsiang-Yao, Calvin Chua Hung Ming, Norhanani Jaafar

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325720

FWCI: 3.557

Cites: 9

Cited by: 2

Related to: 10