How AI can Accelerate R&D for Solder Paste Formulations
Year: 2024
Type: conference-paper
Authors: Mélanie Mathon, Mehdi Guelmoussi, Lucillianna Da Costa, Valérie Lucas, Christophe Dehon
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408325724