Enhancement of Copper Filling by UV Irradiation on Micro-Via
Year: 2024
Type: conference-paper
Authors: Dong-Jae Yi, Keiichiro Sano, Yasushi Umeda, Hideo Honma, Joo-Hyong Noh
Institution: Kanto Gakuin University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408325726