Work

New Die Attach Adhesive Meets Challenging Performance, Reliability and Cost Objectives of Automotive MCU Packaging

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909960

Authors: Jaeik Kang, Xuan Hong, Qizhuo Zhuo, Howard Yun, Kail Shim, Lahiru Rathnayake, Rejoy Surendran, Ram Trichur

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325727

FWCI: 0.806

Cites: 2

Cited by: 1

Related to: 10