Work

CMOS Compatible 2D Material Integration for Sensor Applications on 200mm Wafers

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909811

Authors: Tae Jin Yoo, Deniz Sabuncuoglu Tezcan

Institution: IMEC

Language: English

Topic: 2D Materials and Applications

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325739

FWCI: 3.909

Cites: 6

Cited by: 2

Related to: 10