Work

A Novel Method for PBO Adhesion Characterization in WLCSP Package

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909852

Authors: Yong Chen, Jason Chang, David Gani, Jing-En Luan, Emanuele Cattarinuzzi

Institutions: STMicroelectronics (Singapore), STMicroelectronics (Italy)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325744

FWCI:

Cites: 6

Cited by:

Related to: 10