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Understanding and Improving Rc Management for Wafer Level Packaging Through Novel PVD Processing

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909849

Authors: Anthony Barker, Scott Haymore, Tony Wilby, Amit Rastogi, Ian Moncrieff, Steve Jones, Yen–Chun Chuan Sun

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325751

FWCI: 1.562

Cites:

Cited by: 2

Related to: 10