Work

Aerosol Jet Printed Encapsulation for Optoelectronics: A Study of Line Morphology

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909866

Authors: Kok Siong Siah, Robin Basu, Andreas Distler, Felix Häuβler, Jörg Franke, Christoph J. Brabec, Hans-Joachim Egelhaaf

Institution: Friedrich-Alexander-Universität Erlangen-Nürnberg

Language: English

Topic: Nanomaterials and Printing Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325753

FWCI:

Cites: 30

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Related to: 10