High Temperature Stable Temporary Bond Adhesive for IR Laser Debonding Enables NewProcess Integration For Thin Wafers
Year: 2024
Type: conference-paper
Authors: Amit Kumar, Matthew Koch, Simon Halas, Elisabeth Brandl, Julian Bravin, Peter Urban, Roman Geier, Joerg Siegert
Institutions: Brewer Science (United States), EV Group (Austria), AMS (Austria)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408325756