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Fusion Bonding with Ultra-Thin Dielectric Layers for Photonic Interposer Applications

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909836

Authors: Edward Yong Xi Ong, Chen Gim Guan, Wen Lee

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325771

FWCI: 1.612

Cites: 12

Cited by: 2

Related to: 10