Work

Investigation of the Electromigration Behavior of Solder Bump Under Different Conditions

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909831

Authors: Owen Yi Kei Law, Haibo Fan, Nick Chenchao Zhong, Yuning Shi

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325786

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Cites: 11

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Related to: 10