Work

Innovative Cu-Selective Passivation Coatings for Enhanced Reliability in Cu Interconnects for IC Packaging

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909886

Authors: Dinesh Kumar Kumaravel, Kevin Antony Jesu Durai, Shyam Muralidharan Nair, Khanh Tuyet Anh Tran, Oliver Chyan, Ramarao Poliah, Mei Zhi Chan, Varughese Mathew

Institution: University of North Texas

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Semiconductor Research Corporation

Award: G5754036542

OpenAlex ID: W4408325795

FWCI: 7.254

Cites: 16

Cited by: 9

Related to: 10