Work

Enhancing DI Water Cleanability of Tacky Flux on Cu OSP Surface Using Flip-Chip Copper Pillar High-Density Interconnection

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909934

Authors: Yam Lip Huei, Zhang Rui Fen, Edrina Risson Olakkankal, B. Senthil Kumar, Kang Sungsig, Zhang HanWen

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325797

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Cites: 2

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Related to: 10