Work

Utilizing Ensemble Learning on Small Database for Predicting the Reliability Life of Wafer-Level Packaging

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909858

Authors: Qinghua Su, Cadmus Yuan, K.N. Chiang

Institutions: National Tsing Hua University, Feng Chia University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325806

FWCI: 3.114

Cites: 14

Cited by: 4

Related to: 10