Trade-off Between Chiplet Dimensions and Packaging Parameters for Optimal Performance to Cost for Chiplet Based Heterogeneous Integration
Year: 2024
Type: conference-paper
Authors: Krutikesh Sahoo, Max Zhai, Subramanian Iyer
Institution: University of California, Los Angeles
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408325808