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Predictive Numerical Modeling of Stealth Dicing Process for Different Wafer Pre-Thin Thicknesses

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909815

Authors: Dao Kun Lim, Venkata Rama Satya Pradeep Vempaty, Ankur Harish Shah, Wen How Sim, Harjashan Veer Singh, Yeow Kheng Lim

Institutions: National University of Singapore, Micron (Singapore)

Language: English

Topic: Laser Material Processing Techniques

Subfield: Computational Mechanics

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325809

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Cites: 6

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Related to: 10